H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 23/52 (2006.01) H01L 23/535 (2006.01) H01L 23/538 (2006.01) H01L 25/00 (2006.01) H01L 25/065 (2006.01) H01L 27/00 (2006.01)
Patent
CA 2146868
According to the method of the invention, boards (P) each formed of one or a plurality of semi-conductor pads are provided with leads (F), for example wires, connected to contacts (Pc) of the pads and oriented towards the side faces of the stack. The pads are then stacked and coated with a material (40) which can be selectively removed later. The side faces of the stack are cut so as to make the cross-sections (C) of said leads (F) appear, and connections (Cx) are formed on the faces of the stack, which connections are intended for electrical interconnection of said cross-sections of said leads (F), and the coating material (40) is selectively removed.
Selon le procédé de l'invention, des plaquettes (P) formées chacune d'une ou plusieurs pastilles semi-conductrices sont munies de conducteurs (F), fils par exemple, connectés aux plots (Pc) des pastilles et orientés vers les faces latérales de l'empilement, puis les pastilles sont empilées et enrobées dans un matériau (40) susceptible d'être ultérieurement sélectivement éliminé; on découpe ensuite les faces latérales de l'empilement de sorte à faire apparaître les sections (C) des conducteurs précédents (F), on forme sur les faces de l'empilement des connexions (Cx) destinées à interconnecter électriquement les sections de ces conducteurs (F), puis on élimine sélectivement matériau d'enrobage (40).
Goudreau Gage Dubuc
Thomson-Csf
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