Method for lapping two surfaces of a titanium disk

Details Method for lapping two surfaces of a titanium disk Method for lapping two surfaces of a titanium disk

B - Operations, Transporting

24

C

51/3

B24C 1/06 (2006.01) B24B 37/04 (2006.01)

Patent

CA 2008193

ABSTRACT OF THE DISCLOSURE A method for lapping two surfaces of a titanium disk comprises inserting loosely a titanium disk to be lapped into an opening in a disk-type carrier, the carrier rotating and revolving between an upper surface plate and a lower surface plate which are held in parallel with each other and which applies lapping pressure to the titanium disk, feeding abrasives into among the surface plates and the titanium disk and satisfying the following relationship between thickenss t (mm) of the titanium disk and thickness T (mm) of the carrier: 0.025 exp ( t + 1.5) ? T ? 0.9 t

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