Method for laser soldering

Details Method for laser soldering Method for laser soldering

B - Operations, Transporting

23

K

B23K 26/00 (2006.01) B23K 1/005 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2274339

There is disclosed herein a method for laser soldering, comprising the steps of: (a) providing an electronic component 10 having at least two terminations 12 thereon; a dielectric substrate 14 having a first surface 16 on a first side 18 thereof, a second surface 20 on a second side 22 thereof, and at least two mounting pads 24 arranged on the first surface 16 in matched relation with the terminations 12 of the electronic component 10; and a diode laser 50; (b) depositing solder paste 26 atop the mounting pads 24; (c) placing the electronic component 10 atop the substrate 14 such that each termination 12 rests generally atop its respective mounting pad 24; and (d) directing laser energy 70 from the diode laser 50 to at least one of the mounting pads 24 from the second side 22 of the substrate 14 for a predetermined time, such that the solder paste 26 atop the at least one of the mounting pads 24 is melted.

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