Method for locally enhancing electroplating rates

Details Method for locally enhancing electroplating rates Method for locally enhancing electroplating rates

C - Chemistry, Metallurgy

25

D

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C25D 5/48 (2006.01) C25D 5/00 (2006.01) C25D 5/02 (2006.01) H01L 21/288 (2006.01) H01L 21/768 (2006.01) H05K 3/24 (2006.01)

Patent

CA 1159790

METHOD FOR LOCALLY ENHANCING ELECTROPLATING RATES Abstract A method for high resolution maskless electro- plating is described. Preferential plating results from exposing those regions where enhanced plating is sought to a collimated energy beam. Such exposure can produce an enhancement in the plating rate of 103, which is sufficient to eliminate the necessity of masking the surface.

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