Method for making a debossed conductive film composite

Details Method for making a debossed conductive film composite Method for making a debossed conductive film composite

H - Electricity

05

K

H05K 3/10 (2006.01) H05K 3/04 (2006.01) H05K 3/20 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2223304

A mechanically debossed foil (21) with a circuit pattern is laminated to a thin isotropic uncured and ungelled thermosetting resin film (11). The process comprises debossing a metal foil using a shaping tool with a surface possessing an embossed circuitry pattern, as described in the prior art. The foil (21) is separated from the tool. The separated metal foil (21) is placed in contact with the resin film (11) and forced into the film without significantly altering the foil shape. An optional support layer (18) may be bonded to the film.

On couche une feuille (21), dégaufrée mécaniquement et dotée d'un motif de circuit, sur un mince film de résine (11) thermo durcissable isotrope, non polymérisé et non gélifié. Le procédé consiste à dégaufrer une feuille métallique, à l'aide d'un outil de mise en forme, sur une surface dotée d'un motif de circuit gaufré, comme lorsque l'on applique la technique actuelle. La feuille (21) est séparée de l'outil puis mise en contact avec le film de résine (11), et sans que sa forme en soit significativement modifiée, elle est imprimée dans ce film. On peut éventuellement coller au film une couche de support (18).

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