Method for making a flush surface laminate for a multilayer...

Details Method for making a flush surface laminate for a multilayer... Method for making a flush surface laminate for a multilayer...

H - Electricity

05

K

154/80

H05K 3/46 (2006.01) C09J 5/10 (2006.01) H05K 3/20 (2006.01)

Patent

CA 1283591

ABSTRACT OF THE DISCLOSURE A method for making flush circuit laminates for use in constructing a multilayer circuit board is disclosed. The method comprises laminating together a dielectric sheet(s) of material, such as glass cloth impregnated with epoxy resin, placed between predrilled or pre-punched sheets of a conductive material, such as copper, to form the desired flush circuit laminate, such as a flush surface power core, which, in turn, may be used with other laminates to construct the desired multilayer circuit board. This method allows thinner laminates to be made with acceptable dimensional tolerances which provide improved impedance characteristics compared to laminates made using conventional processes. Thus, the method provides a method of making a more compact, higher speed multilayer circuit board without sacrificing circuit density on the circuit board. If desired, the method may be carried out using all dry processes.

510743

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