H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/46 (2006.01) H05K 3/00 (2006.01) H05K 3/38 (2006.01)
Patent
CA 2470373
The invention concerns a method for making a multilayer module with high-density printed circuits, which consists in: preparing a substrate (1) with double-sided printed circuits (3) whereon is bonded a single-sided plated (7) polyimide (6) additional layer using a polymerisable two-phase epoxy liquid (8); after selectively etching (9) the metal, carrying out anisotropic chemical drilling of micro-holes (12) through the polyimide film (6) by immersing the latter in a static bath of a potassium-added aqueous ethylene-diamine solution at least at 25 ·C; rinsing the adhesive (8) by spraying a solvent in the base of the micro-holes (12); plating the micro-holes (12); and selectively etching the outer metallic film (7, 13) to form therein printed circuits (14) including the plated micro-holes (15).
Procédé de fabrication d'un module multicouches à circuits imprimés à haute densité, selon lequel : on prépare un substrat (1) à circuits imprimés (3) double face sur lequel on colle une couche additionnelle (5) en polyimide (6) métallisé (7) simple face à l'aide d'une colle epoxyde liquide deux états polymérisable (8); après décapage sélectif (9) du métal, on perce chimiquement, de façon anistropique, des micro-trous (12) à travers le film de polyiemide (6) en plongeant celui-ci dans un bain statique d'une solution aqueuse d'éthylène-diamine additionnée de potasse, à au moins 25 ~C ; on rince et on élimine, par pulvérisation d'un solvant, la colle (8) au fond des micro~trous (12) ; on métallise les micro-trous (12) ; et on décape sélectivement la pellicule métallique externe (7, 13) pour y former des circuits imprimés (14) incluant les micro-trous métallisés (15).
Goudreau Gage Dubuc
Organisation Europeenne Pour La Recherche Nucleaire
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