Method for making a multilevel polyimide stencil

Details Method for making a multilevel polyimide stencil Method for making a multilevel polyimide stencil

B - Operations, Transporting

23

K

B23K 26/00 (2006.01) H05K 3/12 (2006.01)

Patent

CA 2189291

A method of using a laser to cut a groove or pocket of predetermined depth of less than about 0.005 inches in a stencil comprising a polyimide sheet having a thickness in the range of 0.005 to 0.012 inches comprising the steps of mounting the stencil on a movable work table and positioning and maintaining a laser a predefined distance from the polyimide sheet above the work table. A laser beam is directed against the polyimide sheet to cut an indentation into said polyimide sheet. The laser beam has a pulse duration and a power level to make the cut into the polyimide sheet. The method further includes the step of directing a gas against the polymide sheet where the laser beam cuts into said polyimide sheet. The gas is pressurized. The depth of the indentation cut into the polyimide sheet by the laser is determined by choosing the pressure of the gas relative to choosing the pulse duration and the power level of the laser beam. The work table is moved relative to the laser whereby the indentation cut into the polyimide sheet creates a groove or pocket as the laser beam moves across the polyimide sheet. By controlling the pressure of the gas normally used to remove dross from the cut edges of the material, the cutting process can be better controlled so that laser milling of polyimide sheet is reliably obtained.

Affiliated with

Also associated with

Rating

Method for making a multilevel polyimide stencil does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for making a multilevel polyimide stencil, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for making a multilevel polyimide stencil will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1523849