Method for making a transponder coil and transponder...

H - Electricity – 01 – F

Patent

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Details

H01F 41/04 (2006.01) G06K 19/077 (2006.01) H05K 3/04 (2006.01)

Patent

CA 2262394

A method for making a transponder comprising the following steps: delimiting the different turns of a coil in a sheet comprising a dielectric substrate coated with at least a conductive layer by stamping the conductive layer with a stamp having cutting contact surfaces with the surface conductive layer; connecting at least an electric component with the turns; assembling at least one protective sheet covering the coil and the electronic component. In order to facilitate the stamping and to obtain neat cuts, the conductive layer is covered with a synthetic film before stamping. In order to prevent short circuits from occurring above the cuts, the latter are preferably filled with glue, varnish or lacquer.

Procédé de fabrication de transpondeur (20) comprenant les étapes suivantes: démarcation des différentes spires (8) d'une bobine dans une feuille (1) comportant un substrat diélectrique recouvert par au moins une couche conductrice (2) par étampage de ladite couche conductrice au moyen d'un poinçon d'étampage (5) présentant des surfaces de contact coupantes (6) avec la couche conductrice superficielle (2; 2'''), connexion d'au moins un composant électronique (25) avec lesdites spires (8), assemblage d'au moins une feuille de protection (22; 27) recouvrant ladite bobine et ledit composant électronique (25). Pour faciliter l'étampage et obtenir des entailles propres, la couche conductrice est recouverte avant étampage par un film synthétique. Pour éviter que des courts-circuits ne s'établissent par-dessus les entailles, ces dernières sont de préférence remplies de colle, de vernis ou de laque.

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