G - Physics – 06 – K
Patent
G - Physics
06
K
G06K 19/077 (2006.01) B42D 15/10 (2006.01) H01Q 1/22 (2006.01) H01Q 17/00 (2006.01) G09F 3/02 (2006.01)
Patent
CA 2707072
The present invention provides a method of manufacturing an article comprising a fiber layer (5) and at least one electronic chip (7), the fiber layer being formed by depositing fibers on a surface (3) immersed in a dispersion (4) of fiber material. The method includes the following step: using an elongate flexible support (6) to bring the electronic (5) chip into contact with the fiber layer that is being formed.
La présente invention concerne un procédé de fabrication d'un article comportant une couche fibreuse (5) et au moins une puce électronique (7), la couche fibreuse étant formée par dépôt de fibres sur une surface (3) immergée dans une dispersion (4) de matière fibreuse. Le procédé comporte l'étape suivante: -amener au contact de la couche fibreuse en formation la puce électronique au moyen d'un support flexible (6) de forme allongée.
Rancien Sandrine
Terliska Jacques
Arjo Wiggins Security Sas
Robic
LandOfFree
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