Method for making an article comprising at least a silicon chip

G - Physics – 06 – K

Patent

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Details

G06K 19/077 (2006.01) B42D 15/10 (2006.01) H01Q 1/22 (2006.01) H01Q 17/00 (2006.01) G09F 3/02 (2006.01)

Patent

CA 2707072

The present invention provides a method of manufacturing an article comprising a fiber layer (5) and at least one electronic chip (7), the fiber layer being formed by depositing fibers on a surface (3) immersed in a dispersion (4) of fiber material. The method includes the following step: using an elongate flexible support (6) to bring the electronic (5) chip into contact with the fiber layer that is being formed.

La présente invention concerne un procédé de fabrication d'un article comportant une couche fibreuse (5) et au moins une puce électronique (7), la couche fibreuse étant formée par dépôt de fibres sur une surface (3) immergée dans une dispersion (4) de matière fibreuse. Le procédé comporte l'étape suivante: -amener au contact de la couche fibreuse en formation la puce électronique au moyen d'un support flexible (6) de forme allongée.

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