Method for making an integrated optical circuit

G - Physics – 02 – B

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G02B 6/13 (2006.01) G02B 6/12 (2006.01) G02B 6/122 (2006.01)

Patent

CA 2395070

In order to manufacture an integrated optical circuit, a first mask (8a) is formed on a face of a substrate (7), the first mask defining the shape of at least one optical device, such as a waveguide, to be formed in a first region of the substrate. A second mask (11a) is formed on said face of the substrate. The second mask corresponds to an optical structure, such as a periodic array structure, to be formed in a second region of the substrate, distinct from the first region. The first and second masks are each made of a material which substantially resists a predetermined etching gas. Then the substrate, supporting the first and second masks, is dry etched using the predetermined etching gas.

Pour fabriquer un circuit intégré optique, on forme un premier masque (8a) sur une face d'un substrat (7), le premier masque définissant la forme d'au moins un dispositif optique tel qu'un guide d'ondes qui devra être formé dans une première région du substrat. Un deuxième masque (11a) est formé sur ladite face du substrat. Le deuxième masque correspond à une structure optique telle qu'un structure de réseau périodique, qui devra être formée dans une deuxième région du substrat distincte de la première. Les premier et deuxième masques sont faits chacun d'un matériau qui résiste sensiblement à un gaz de gravure prédéterminé. Le substrat sur lequel reposent les premier et deuxième masques est ensuite gravé à sec au moyen du gaz de gravure prédéterminé.

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