Method for making conduction-cooled circuit package

Details Method for making conduction-cooled circuit package Method for making conduction-cooled circuit package

H - Electricity

01

L

356/21, 356/3, 3

H01L 23/34 (2006.01) H01L 23/373 (2006.01) H01L 23/433 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1083261

METHOD FOR MAKING CONDUCTION-COOLED CIRCUIT PACKAGE Abstract A method for making a circuit package which exhibits an excellent heat transfer path from a semiconductor chip or other heat generating device to the heat sink can or cover of the package. A heat conducting pad is placed in proximate relationship to either the heat sink or to a surface of the chip and is metallurgically bonded to the other. In one of the preferred embodiments a low melting point solder, such as indium or an alloy thereof, is metal- lurgically bonded to the inside of the heat sink cover in a limited central region thereof. The solder is then posi- tioned adjacent the chip and reflowed to substantially fill in the gap between the solder and the chip, but with no stress between the chip and the solder. The assembly exhibits excellent heat transfer from the chip to the cover and any associated heat dissipating structures. The pre- ferred method involves the reflow of a mass of solder against the back side of the chip, which has previously been solder- bonded on the front side to conductors on the surface of an alumina substrate.

285782

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