G - Physics – 03 – C
Patent
G - Physics
03
C
356/18
G03C 5/00 (2006.01) H05K 3/24 (2006.01) H05K 3/34 (2006.01) H05K 3/42 (2006.01) H05K 3/06 (2006.01) H05K 3/28 (2006.01)
Patent
CA 1258138
-25- ABSTRACT OF THE DISCLOSURE Printed circuit boards having solder coated pads and through-holes and bare copper traces protected by a directly applied solder mask or by a coating of non- reflowable metal and a solder mask thereover, are manu- factured by a process which avoids the need for tin-lead stripping and the need for separate application and leveling of molten solder. In the preferred process, liquid resists are applied to circuit boards having tin-lead over copper plated holes and pads so as to define and etch protect bare copper traces of desired pattern circuitry (as well as other desired configu- rations). Copper areas other than those protected by the etch-resist and tin-lead plating are etched away, the etch-resist removed and solder mask applied over the bare copper traces or other desired bare copper areas or, alternatively, to bare copper first coated with a non-reflowable metal. The tin-lead plating is then preferably reflowed and solidified to provide the pads and through-holes with solder coating.
515260
Castaldi Steven A.
Larson Gary B.
Ruszczyk Stanley J.
Macdermid Inc.
Perley-Robertson Hill & Mcdougall Llp
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