H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 21/461 (2006.01) G01C 19/56 (2006.01) G01P 15/125 (2006.01) H01L 21/78 (2006.01)
Patent
CA 2612283
The present invention relates to measuring devices used in measuring physical quantities, such as acceleration, angular acceleration, or angular velocity, and, more precisely, to micromechanical motion sensors. The area, in the wafer plane, of a motion sensor component according to the present invention is smaller than the area of the motion sensor component having been dice cut and turned by 90~. Correspondingly, the height of the motion sensor component according to the present invention, the component having been turned by 90~, is smaller, in the direction of the joint, than the thickness of the wafer stack formed by the joined wafers. The object of the invention is to provide an improved method of manufacturing a micromechanical motion sensor, and to provide a micromechanical motion sensor suitable, in particular, for use in small micromechanical motion sensor solutions.
La présente invention concerne des dispositifs servant à mesurer des grandeurs physiques, telles que l~accélération, l~accélération angulaire ou la vitesse angulaire, et, plus précisément, des capteurs de mouvement micromécaniques. Selon la présente invention, la surface du plan de tranche d~un composant capteur de mouvement est inférieure à la surface du composant après découpage en dés et rotation de 90 º. De ce fait, selon la présente invention, la hauteur du composant capteur de mouvement, après sa rotation de 90 º, est inférieure, dans le sens de la connexion, à l~épaisseur de la matrice formée par les tranches connectées. L~objet de l~invention consiste à fournir un meilleur procédé de fabrication d~un capteur de mouvement micromécanique, et à fournir un capteur de mouvement micromécanique adapté, en particulier, à une utilisation dans des solutions de détection de petite taille.
Bereskin & Parr Llp/s.e.n.c.r.l.,s.r.l.
Vti Technologies Oy
LandOfFree
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