H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/172, 18/906
H01L 23/28 (2006.01) H01L 21/56 (2006.01) H01L 23/31 (2006.01) H01L 23/48 (2006.01) H01L 23/495 (2006.01)
Patent
CA 1174821
ABSTRACT OF THE DISCLOSURE: Disclosed is a method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor. A semiconductor device assembly is formed, using a lead frame an external lead of which extends to one side of a substrate support serving as a heat sink and supporting a semiconductor substrate, and strips of which extend to the other end of the substrate support. The external lead and strips are clamped by upper and lower molds for plastic encapsulation. A connecting portion between the external lead and a connecting band and the strips extending from a plastic encapsulating housing to the outside are cut. The substrate support is, thus, held properly at the time of plastic encapsulation, preventing bending of the semiconductor device due to injection pressure of the plastic. Therefore, a thin film of plastic is uniformly and with high precision formed on a lower surface of the substrate support.
397622
Fujii Hiroyuki
Nishikawa Mikio
Tateno Kenichi
Gowling Lafleur Henderson Llp
Matsushita Electric Industrial Co. Ltd.
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