C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 7/04 (2006.01) A61F 2/06 (2006.01) B23H 3/00 (2006.01) C25D 5/34 (2006.01) C25D 5/36 (2006.01) C25D 5/38 (2006.01) C25D 5/48 (2006.01) C25D 5/50 (2006.01) G03B 27/04 (2006.01) G03F 7/18 (2006.01) G03F 7/24 (2006.01) A61F 2/00 (2006.01)
Patent
CA 2283850
Disclosed herewithin is a method of fabricating a stent which involves processing a tubular member whereby no connection points to join the edges of a flat pattern are necessary. The method includes the steps of a) removing contaminates from a tubular member, b) coating the outside surface of the tubular member with a photo- sensitive resist material, c) placing the tubular member in an apparatus designed to simultaneously rotate the tubular member while passing a specially configured photographic frame negative between a UV light source and the tubular member, thereby exposing a specified pattern of UV light to the resist coated tubular member, d) exposing the outside surface of the tubular member to a photoresist developer for a specified period of time, e) rinsing the excess developer and uncured resist from the outside surface of the tubular member, and f) treating the tubular member with an electro-chemical process to remove uncovered metal. This process can lend itself to virtually an unlimited number of stent designs and configurations. By modifying the photographic frame negative, the same process can be employed to fabricate various stent designs from a tubular structure.
L'invention concerne un procédé de fabrication d'un extenseur, consistant à traiter un élément tubulaire sans utiliser de points de jonction pour rattacher les bords d'une structure plate. Les étapes du procédé consistent: à éliminer (20) les contaminants de l'élément tubulaire, à appliquer (24) un résist photosensible sur la surface extérieure de cet élément, à placer (26) celui-ci dans un dispositif conçu pour assurer simultanément la rotation de l'élément et le passage d'un négatif d'image photographique à configuration spéciale entre une source de lumière UV et l'élément en question, à exposer (28) la surface extérieure dudit élément à un développateur de photorésist pendant une durée spécifiée, à rincer (30) le développateur en excès et le résist non durci de la surface extérieure de l'élément, et à traiter (32) l'élément selon un procédé électrochimique visant à ôter le métal non recouvert.
Gomringer Gary
Trozera Thomas
Borden Ladner Gervais Llp
Interventional Technologies Inc.
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