Method for manufacturing a thin copper plate with flow conduits

Details Method for manufacturing a thin copper plate with flow conduits Method for manufacturing a thin copper plate with flow conduits

F - Mech Eng,Light,Heat,Weapons

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F28D 3/00 (2006.01) B21D 53/04 (2006.01) F28F 3/14 (2006.01)

Patent

CA 1168844

ABSTRACT OF THE DISCLOSURE A method of manufacturing a thin plate or band from copper or a copper alloy is disclosed, the plate or band having flow conduits parallel to its plane, in which a thicker copper plate billet, which also has flow conduits parallel to its plane and the total wall thickness of which, as measured in a direction perpendicular to the plane of the plate, is equal to the thickness of the plate on both sides of the flow conduit, is cold worked to its final material thickness, whereafter the flow conduit flattened during the rolling is opened by means of pressure produced inside it.

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