H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/20, 154/72.0
H05K 3/44 (2006.01) B32B 15/08 (2006.01) H05K 1/05 (2006.01) H05K 1/00 (2006.01) H05K 3/38 (2006.01)
Patent
CA 1303243
20365-2887 ABSTRACT OF THE DISCLOSURE A method for the manufacturing of a metal core pc board which provides for manufacturing of two or three dimensional metal core pc boards of any form with or without throughplating. The manufacturing of such pc boards can occur by injection molding, injection/compressing molding or by a pressing method. High-heat resistant theremoplastics, as well as duroplastics are preferably employed as pc board materials. A metal with good thermal conductibility is used for the core. The material is selected such that the thermal expansion coefficients of the metal core and the pc board material are optimally equal. The manufacturing contains the following steps: lamination of the metal plate with a plastic foil on one or both sides; introduction of the desired hole pattern with a corresponding over dimension into the laminated metal plate; placing of such prepared metal core in an injection molding tool: and thermoforming the plastic on the laminated core over the plastic foil and simultaneously filling out the holes to a final dimension with the plastic.
587646
Hadwiger Helmut
Schmidt Hans F.
Aktiengesellschaft Siemens
Fetherstonhaugh & Co.
Hadwiger Helmut
Schmidt Hans F.
LandOfFree
Method for manufacturing metal core printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for manufacturing metal core printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for manufacturing metal core printed circuit boards will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1304114