Method for manufacturing polyimide multilayer wiring substrate

Details Method for manufacturing polyimide multilayer wiring substrate Method for manufacturing polyimide multilayer wiring substrate

H - Electricity

05

K

H05K 1/02 (2006.01) H01L 21/48 (2006.01) H01L 23/538 (2006.01) H05K 3/46 (2006.01) H05K 3/00 (2006.01) H05K 3/28 (2006.01) H05K 3/32 (2006.01) H05K 3/40 (2006.01)

Patent

CA 2083072

A layered structure comprising wiring layers and polyimide layers is formed on a ceramics board and a layered structure comprising wiring layers and polyimide layers is formed on an aluminum board. Both the structures are bonded together through adhesives to bring metal bumps formed on the former structure into electric contact with metal bumps formed on the surface of the latter structure and thereafter the aluminum board is removed.

Structure en couches comprenant des couches de fils et des couches de polyimides formée sur une carte de céramique et structure en couches comprenant des couches de fils et des couches de polyimides formée sur une carte d'aluminium. Les deux structures sont réunies à l'aide d'adhésifs de manière à amener les bosses du métal formées sur la première structure à entrer en contact sur le plan électrique avec les bosses du métal forées à la surface de la deuxième structure et, par la suite, la carte d'aluminium est enlevée.

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