Method for manufacturing thin boards, in particular parquet...

B - Operations – Transporting – 27 – M

Patent

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B27M 3/04 (2006.01) B27L 5/06 (2006.01)

Patent

CA 2171508

Proposed herein is a method for manufacturing thin boards, in particular parquet laminates, from a square timber by repeated separation of a thin board from the square timber, without the formation of chips, in a cutter machine or in a series of cutter machines that are arranged one after the other, and by repeated passage of the residual square timber that is not yet completely divided into thin boards through the cutter machine(s), in particular in a series of cutting machines that are arranged one after the other, in which the square timber is divided into thin boards in one pass, the square timber being moved against a generally stationary blade to separate a thin board, in each instance in the longitudinal direction in which its fibers are oriented, and in which at least one thickness measurement is effected during the passage of the square timber through the cutting machine(s). The method is characterized in that the thickness of the thin boards produced in each individual cutting machine (1, 1.1, 1.i, 1.n) is determined individually, the measured actual value of the thickness of the boards from one cutting machine (1, 1.1, 1.i, 1.n) is compared with the nominal value of the thickness of the thin boards that are to be produced from these cutter machines (1, 1.1, 1.i, 1.n), a signal being obtained from a deviation from the nominal value of the thickness and used to correct the blade settings of the particular cutter machine (1, 1.1, 1.i, 1.n) that are relevant to thickness for separation of thin boards from the following square timbers. Also proposed in an installation for the cutting type separation of thin boards from a square timber in such a way that no chips are generated.

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