Method for maskless chemical and electrochemical machining

C - Chemistry – Metallurgy – 23 – F

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204/86.6

C23F 1/02 (2006.01) C25F 3/14 (2006.01) H01L 21/3213 (2006.01)

Patent

CA 1171381

Abstract A method for high resolution maskless chemical and electrochemical machining is described. Preferential etching results from exposing those regions where machining is sought to an energy beam. Such exposures can increase the etching rate in the base of electrochemical machining by a factor of 103 to 104. Such enhancement is sufficient to make masking unnecessary.

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