Method for metallizing dielectric surfaces containing a metal

Details Method for metallizing dielectric surfaces containing a metal Method for metallizing dielectric surfaces containing a metal

C - Chemistry, Metallurgy

23

C

C23C 18/30 (2006.01) C23C 18/16 (2006.01) C23C 18/18 (2006.01) H05K 3/42 (2006.01) H05K 1/03 (2006.01) H05K 3/18 (2006.01)

Patent

CA 2061297

ABSTRACT OF THE DISCLOSURE "Method for metallizing dielectric surfaces containing a metal" The method for metallizing a dielectric surface according to the invention is carried out in two successive steps. The first step consists of irradiating the surface of the dielectric material by a previously adjusted laser beam (wave length, energy, energy density, irradiation time). The second step consists of immersing the piece of dielectric material after the irradiation into an autocatalytic bath containing the metal that one wishes to deposit. This deposit is formed by electroless plating only in the irradiated zones and follows exactly the geometrical profile of these zones. The remaining part of the surface, which has not been irradiated, is not coated by metal during the immersion into the bath. The characteristics of the metal deposit (thickness, profile, structure) are completely controlled by the irradiation characteristics and by the characteristics of the dielectric material and of the autocatalytic bath.

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