Method for monitoring the surface resistivity of metallized...

G - Physics – 01 – J

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33/63, 117/74, 3

G01J 1/00 (2006.01) G01B 11/06 (2006.01) G01N 21/01 (2006.01)

Patent

CA 1057045

ABSTRACT OF THE DISCLOSURE Described herein is a method of monitoring surface resistivity distribution resulting from vacuum deposition of thin, transport metal films on moving plastic film or other transparent substrates. The process comprises applying to the metallized film electromagnetic radiation and detecting and band width of electromagnetic radiation transmitted through or reflected from the metallized film in the near-infrared region, more particularly within the wavelength range of about 1.5 to 3.0 microns. The detected band width permits excellent correlation between transmitted radiation and local conductivity or, reciprocally, resistivity of vacuum deposited gold, silver, and copper. Vacuum deposition can occur, e.g., by vacuum evaporation or sputtering. The metallized films are useful in the production of electrically heated transparent closures such as for automobile windshields.

240980

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