H - Electricity – 04 – N
Patent
H - Electricity
04
N
H04N 5/369 (2011.01) H01L 27/146 (2006.01)
Patent
CA 2649157
A method for manufacturing camera modules including image capture devices with protective covers is disclosed. The method includes providing a unitary transparent substrate including a plurality of individual protective covers, providing a unitary component substrate including a plurality of individual component parts, bonding the unitary transparent substrate to the unitary component substrate, dividing the transparent substrate into a plurality of discrete protective covers, and separating the component parts from one another. According to one particular method, the component substrate is a semiconductor wafer having a plurality of integrated electronic image capture devices formed therein. According to another particular method, the component substrate is a circuit board having a plurality of individual device circuit boards formed therein.
L'invention concerne un procédé de fabrication de modules de caméra comprenant des dispositifs de saisie d'images équipés de couvertures de protection. Le procédé consiste à utiliser un substrat transparent autonome comprenant une pluralité de couvertures de protection individuelles, à utiliser un substrat de composant autonome comprenant une pluralité de composants individuels, à lier le substrat transparent autonome au substrat de composant autonome, à diviser le substrat transparent en une pluralité de couvertures de protection discrètes et à séparer le composants les uns des autres. Selon un procédé particulier, le substrat de composant est une plaquette de semi-conducteur comprenant une pluralité de dispositifs de saisie d'images intégrés. Selon un autre procédé particulier, le substrat de composant est une carte de circuit imprimé comprenant une pluralité de cartes individuelles de circuit imprimé.
Shangguan Dongkai
Tam Samuel Waising
Flextronics Ap Llc
Gowling Lafleur Henderson Llp
LandOfFree
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