Method for packaging a microwave tube modulator

Details Method for packaging a microwave tube modulator Method for packaging a microwave tube modulator

H - Electricity

01

L

332/24, 347/33,

H01L 25/16 (2006.01) H01L 23/66 (2006.01) H01L 25/11 (2006.01)

Patent

CA 1282467

P-324 METHOD FOR PACKAGING A MICROWAVE TUBE MODULATOR ABSTRACT A method for packaging components in the primary circuit of a microwave tube modulator output transformer. Modules are assembled using parallel plates upon and around which transistors and other necessary components are mounted. In addition to providing mechanical support for the components, the plates act as conductors for circuits common to respective elements of paralleled transistors, thereby minimizing electrical resistance and inductance in the primary circuit. The modules are designed to mount to the output transformer such that two of the parallel plates are mechanically connected to the respective two ends of the transformer primary, and a number of modules can be mounted around and to one transformer according to the amount of energy required.

582433

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