Method for packaging semiconductor device

Details Method for packaging semiconductor device Method for packaging semiconductor device

H - Electricity

01

L

356/167

H01L 23/12 (2006.01) H01L 21/00 (2006.01) H01L 21/60 (2006.01) H01L 21/68 (2006.01) H05K 3/30 (2006.01) H05K 1/02 (2006.01)

Patent

CA 2034702

ABSTRACT OF THE DISCLOSURE The present invention comprises the steps of electrically connecting at least one pair of bumps on the semiconductor device, bringing the bumps into contact with a surface of the packaging substrate and moving the semiconductor device relative to the packaging substrate while monitoring whether at least one pair of electrode terminals formed on the surface of the packaging substrate are electrically connected to each other, positioning the semiconductor device with respect to the packaging substrate at a position where the electrode terminals whose electrical connection is monitored are electrically connected to each other, and packaging the semiconductor electrode on the packaging substrate.

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