H - Electricity – 01 – L
Patent
H - Electricity
01
L
H01L 33/48 (2010.01)
Patent
CA 2656314
This invention relates to light-emitting diodes or devices (LEDs), such as LED lighting assemblies and methods of manufacturing them. More particularly, this invention relates to white-light LED lighting assemblies, devices, and components, methods for packaging white-light LEDs, and LED devices produced thereby. A method for packaging a white-light LED is provided comprising providing a substrate with a resin injection hole and a vent hole, a packaging housing, at least one LED chip, a supporting frame and resin, installing the LED chip on the substrate, coating an inner wall of the packaging housing with fluorescent powder, connecting the packaging housing to the substrate by way of the supporting frame, so that a cavity is formed therebetween, injecting the resin into the cavity between the packaging housing and the substrate by way of the resin injection hole so that gas within the cavity is discharged by way of the vent hole, and curing the resin. LED assemblies made according to this method are also provided.
Li Junzheng
Li Qing
Liang Lifang
Yu Binhai
Cassan Maclean
Foshan Nationstar Optoelectronics Co. Ltd.
Virginia Optoelectronics Inc.
LandOfFree
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