Method for perforating heat meltable material

Details Method for perforating heat meltable material Method for perforating heat meltable material

B - Operations, Transporting

26

D

B26D 7/18 (2006.01) B26F 1/26 (2006.01)

Patent

CA 2633169

The present invention relates to a method for making holes in a layer (1) of heat-fusible material. According to the invention a layer of absorbent material (2) is placed in contact with a layer (1) of heat- fusible material, following which the layer of heat-fusible material is heated locally so that holes are formed in the material.

La présente invention concerne un procédé servant à réaliser des trous dans une couche (1) de matériau fusible à la chaleur. Selon l'invention une couche de matériau absorbant (2) est placée en contact avec une couche (1) de matériau fusible à la chaleur, à la suite de quoi la couche de matériau fusible à la chaleur est chauffée localement de sorte que des trous soient percés dans le matériau.

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