Method for plating polyamide resin molded article

Details Method for plating polyamide resin molded article Method for plating polyamide resin molded article

C - Chemistry, Metallurgy

23

C

204/18, 117/75

C23C 18/22 (2006.01) H05K 1/03 (2006.01) H05K 3/18 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1250543

ABSTRACT OF THE DISCLOSURE A method for plating a polyamide resin molded article which comprises carrying out, before plating treat- ment, etching treatments, namely the first etching treatment with an aqueous stannic chloride solution and then the second etching treatment with an aqueous acid solution, and brings about a plating effect excellent in strength of adhesion of the plating film and in plating appearance.

467757

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