B - Operations – Transporting – 24 – B
Patent
B - Operations, Transporting
24
B
B24B 37/04 (2006.01) C09G 1/02 (2006.01) H01L 21/321 (2006.01)
Patent
CA 2467806
According to one aspect of the invention, an improved process for preparing a surface of substrate is provided wherein the surface of the substrate is prepared for a chemical mechanical polishing (CMP) process, the CMP process is performed on the surface of the substrate, and the surface of the substrate is finished to clear the substrate surface of any active ingredients from the CMP process. Also, an improved substrate produced by the method is provided. According to one aspect of the invention, particular polishing materials and procedures may be used that allow for increased quality of AIN substrate surfaces.
L'invention concerne dans un de ses aspects un procédé amélioré de préparation d'une surface de substrat, qui comporte les étapes consistant à préparer ladite surface en vue de la mise en oeuvre d'un procédé de polissage mécanique-chimique (CMP) ; à mettre en oeuvre le procédé CMP sur la surface du substrat ; et à finir la surface du substrat pour éliminer de celle-ci toute matière active du procédé CMP. L'invention concerne aussi un substrat amélioré produit grâce au procédé. Dans un aspect de l'invention, des matières de polissage et des procédures particulières peuvent être utilisées afin d'obtenir une qualité accrue de surfaces de substrat en AlN.
Martinez Lopez Javier
Morgan Kenneth
Rojo Carlos J.
Schowalter Leo J.
Crystal Is Inc.
Rensselaer Polytechnic Institute
Smart & Biggar
LandOfFree
Method for polishing a substrate surface does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for polishing a substrate surface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for polishing a substrate surface will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1768918