H - Electricity – 05 – K
Patent
H - Electricity
05
K
25/139, 356/154
H05K 1/11 (2006.01) C04B 41/51 (2006.01) C04B 41/88 (2006.01) H01L 21/48 (2006.01) H01L 23/15 (2006.01) H01L 23/538 (2006.01) H05K 3/10 (2006.01) H05K 1/09 (2006.01)
Patent
CA 1078079
A METHOD FOR PREPARING A MULTILAYER CERAMIC Abstract A method for manufacturing a multilayer ceramic which is particularly suitable for carrying semiconductor chips. In order to join a semiconductor chip to a multi- layer ceramic substrate, it is necessary that the projected site for the semiconductor chip be substantially flat. If there is a bulge, it becomes difficult to make a good joint thereto. The method involves depositing a particulate mix- ture containing a metal and the metal's oxide in a ratio of between 1:1 to 9:1 in a pattern on at least a portion of the plurality of ceramic layers. The patterns are then dried. The plurality of substrates or layers of ceramic are then laminated under substantial pressure and fired at an elevated temperature. The addition of the metal oxide to the metal powder allows the shrinkage of the metallization compound so that it may more nearly match that of the ceramic it is coated upon during the firing step. This matching of the shrinkage during firing pre- vents cracking of the ceramic.
271025
Blazick Linda A.
Miller Lewis F.
LandOfFree
Method for preparing a multilayer ceramic does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for preparing a multilayer ceramic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for preparing a multilayer ceramic will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-528496