G - Physics – 06 – K
Patent
G - Physics
06
K
G06K 19/077 (2006.01) H01L 21/56 (2006.01) H01L 23/31 (2006.01) H01L 23/498 (2006.01)
Patent
CA 2333790
The invention relates to a method for producing an integrated circuit, including a step whereby a module (12) is created and fixed on the body of a card (20) and provided with an integrated circuit (14) and contact pads (16). The invention is characterised in that the step in which the module (12) is created comprises a stage that consists in forming slots in a plate element (26) that is made from a conducting material, whereby said slots define at least partially the areas of the plate element (20) that will form the contact pads. The invention is also characterised by a subsequent step that consists in coating a lower face (32) of the plate element at least partially with adhesive matter (30) to enable the module (12) to be fixed to the body of the card (20) at a later stage.
L'invention propose un procédé de fabrication d'une carte à circuit intégré, du type comportant l'étape consistant à réaliser un module (12) qui est fixé sur un corps de carte (20) et qui comporte notamment un circuit intégré (14) et des plages de contact (16), caractérisé en ce que l'étape de réalisation du module (12) comporte une étape consistant à former, dans un élément de plaque (26) en matériau conducteur, des fentes (28) qui délimitent au moins partiellement des zones de l'élément de plaque (20) destinées à former les plages de contact (16), et une étape ultérieure consistant à recouvrir, au moins partiellement, une face inférieure (32) de l'élément de plaque (26) d'une masse adhésive (30) par lequel le module (12) est destiné à être fixé ultérieurement sur le corps de carte (20).
Elbaz Didier
Fidalgo Jean-Christophe
Patrice Philippe
Zafrany Michael
Gemplus
Robic
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