Method for producing an optical device

Details Method for producing an optical device Method for producing an optical device

H - Electricity

01

L

345/62

H01L 33/00 (2006.01)

Patent

CA 1273091

METHOD FOR PRODUCING AN OPTICAL DEVICE Abstract of the Disclosure: In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bond- ing pad by said solder layer, the optical device chip is die-bonded in a stable state.

603408

Affiliated with

Also associated with

Rating

Method for producing an optical device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing an optical device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing an optical device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1242466