H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/12, 117/42
H05K 1/00 (2006.01) H05K 3/00 (2006.01)
Patent
CA 1281142
ABSTRACT A process for producing circuit boards involves the coating of a temporary subsrate with a fluid mixture of an epoxy polymer component and a rubber polymer which is interactive therewith at temperatures of at least 180°F. Preferably the rubber is a low molecular weight polyfunctional reactive butadiene/acrylonitrile interpolymer which is terminated by vinyl or carboxyl functional groups. The rubber component comprises at least 70 percent by weight of the epoxy polymer component, and the coating has a thickness of 0.001-0.015 inch. The coating is air dried upon the temporary substrate, and then the coating is transferred to the resinous substrate of the circuit board by heat and pressure. The coating is partially cured to effect partial polymerization of the epoxy prepolymer, further polymerization of the rubber, if it is of low molecular weight, and interaction of the rubber and epoxy polymer to form a matrix of the interacted rubber/epoxy. The exposed surface of this coating is then etched, and metal is deposited on the surface to form a conductive layer. A conductive pattern is formed therein, and heat and pressure is applied to at least the conductive layer and coating to fully cure the coating and bond the coating to the conductive layer, and thus the conductive pattern to the resinous substrate. The metal layer may be deposited chemically or by vacuum metallizing and like techniques. The present invention relates to circuit boards, and more particularly to a novel process for producing circuit boards in which a conductive layer of metal forms a circuit pattern upon, and is firmly bonded to, a resinous substrate providing the support therefor, and to the well defined and bonded circuit boards which are produced thereby.
585684
Chant Peter R.
Firan Corporation
Marks & Clerk
LandOfFree
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