H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/134
H01L 21/3213 (2006.01) H01L 21/304 (2006.01) H01L 21/768 (2006.01) H05K 3/04 (2006.01) H05K 3/10 (2006.01) H05K 3/46 (2006.01)
Patent
CA 1248641
ABSTRACT Patterned conductive lines are formed simultane- ously with stud via connections through an insulation layer to previously formed underlying patterned conductive lines in multilevel VLSI chip technology. A first planarized layer of insulation is deposited over a first level of patterned conductive material to which contacts are to be selectively established. The first layer then is covered by an etch stop material. Contact holes are defined in the etch stop material at locations where stud connectors are required. The first layer of insulation is not etched at this time. Next, a second planarized layer of insulation, is deposited over the etch stop material. The second layer insulation, in turn, is etched by photolitho- graphy down to the etch stop material to define desired wiring channels, some of which will be in alignment with the previously formed contact holes in the etch stop material. In those locations where the contact holes are exposed, the etching is continued into the first layer of insulation to uncover the underlying first level of patterned conductive materi- al. The channels and via holes are overfilled with metallization. The excess metallization is removed by etching or by chem-mech (chemical-mechanical) polish- ing.
514222
Chow Melanie M.
Cronin John E.
Guthrie William L.
Kaanta Carter W.
Luther Barbara J.
International Business Machines Corporation
Saunders Raymond H.
LandOfFree
Method for producing coplanar multi-level metal/insulator... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for producing coplanar multi-level metal/insulator..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing coplanar multi-level metal/insulator... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1181410