Method for producing metal conductors on a substrate

Details Method for producing metal conductors on a substrate Method for producing metal conductors on a substrate

C - Chemistry, Metallurgy

23

C

C23C 18/16 (2006.01) C23C 18/40 (2006.01) C23C 18/44 (2006.01)

Patent

CA 2526068

The invention relates to a method for producing metal conductors, for instance copper conductor patterns as electronic components on a substrate, such as paper. Said method is particularly suitable for producing metal conductors on papers for large scale mass production using printing or like machines. In the method, an electroless deposition is carried out in at least two steps wherein a solution is made of one of the metallic starting material or the reducing agent, or the other one is present in a gas or vapour form, followed by successive application thereof on the substrate.

L'invention concerne un procédé pour réaliser des conducteurs métalliques, par exemple des motifs conducteurs en cuivre formant des composants électroniques, sur un substrat, tel que du papier. Ledit procédé est particulièrement adapté à la réalisation de conducteurs métalliques sur papier pour la production de masse sur grande échelle faisant appel à des machines d'impression ou analogues. Selon le procédé présenté, on effectue un dépôt autocatalytique en au moins deux étapes, lesquelles consistent à former une solution de la matière métallique de départ ou de l'agent de réduction, ladite matière ou ledit agent étant présents sous forme de gaz ou de vapeur, et à effectuer ensuite le dépôt de ladite matière sur le substrat.

Affiliated with

Also associated with

Rating

Method for producing metal conductors on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing metal conductors on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing metal conductors on a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2055079