H - Electricity – 05 – K
Patent
H - Electricity
05
K
25/128, 261/13
H05K 1/03 (2006.01) C03C 10/00 (2006.01) H01L 21/48 (2006.01) H01L 23/15 (2006.01) H05K 3/46 (2006.01) H05K 1/09 (2006.01)
Patent
CA 1235711
METHOD FOR PRODUCING MULTILAYER CERAMIC CIRCUIT BOARD A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass- ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.
482214
Imanaka Yoshihiko
Kamehara Nobuo
Kurihara Kazuaki
Niwa Koichi
Ogawa Hiromi
Fujitsu Limited
Mcfadden Fincham
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