C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/11, 400/5326
C08G 77/00 (2006.01) C01B 31/36 (2006.01) C04B 35/571 (2006.01) C08G 77/60 (2006.01) D01F 6/96 (2006.01)
Patent
CA 1077512
Abstract of the Disclosure Organosilicon high molecular weight compounds having silicon and carbon as the main skeleton components and consisting of a mixture of linear polycarbosilanes having silicon and carbon as the main skeleton components, cyclic polycarbosilanes having silicon and carbon as the main skeleton components and polycarbosilanes in which linear carbosilane and cyclic carbosilane are chemically bonded are produced by thermally decomposing and polycon- densing at least one of organosilicon compound having polysilane skeleton selected from the group consisting of cyclic polysilanes shown by the following formula (R1?R2?Si)n, n?4 wherein R1 and R2 are hydrogen, alkyl group, aryl group, silyl group, or a halogen and linear polysilane shown by the following formula Image wherein R1, R2, R3 and R4 are hydrogen, alkyl group, aryl group, silyl group or a hologen, by heating at a temperature of 300-2,000°C under at least one atmosphere of an inert gas and hydrogen gas or under a vacuum. The compounds can be used as starting materials for production of silicon carbide fibres having a higher tensile strength than piano wire and silicon carbide moldings having noticeably high tensile strength.
250621
Hayashi Josaburo
Omori Mamoru
Yajima Seishi
LandOfFree
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