Method for producing printed circuit boards with punched...

Details Method for producing printed circuit boards with punched... Method for producing printed circuit boards with punched...

H - Electricity

05

K

356/1

H05K 3/42 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1158364

ABSTRACT A method for producing printed circuit boards with holes having walls provided with a metal coating on base material provided with an adhesive layer which, in turn, is covered by a masking foil composed of plastic material or metal. Following the preparation of the pattern of holes and prior to the removal of the masking foil, the layer of adhesive coating is removed at the edges of the holes by chemical action, so that an annular zone free of adhesive is formed underneath the masking foil. The masking foil is subsequently removed and the metallization of the pattern of conductors and walls of the holes is produced by currentless deposition alone or combined with galvanic precipita- tion.

371878

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