Method for producing substrates with passages

H - Electricity – 05 – K

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H05K 1/11 (2006.01) H05K 3/00 (2006.01) H05K 3/40 (2006.01) H05K 3/42 (2006.01) H05K 1/00 (2006.01) H05K 1/05 (2006.01) H05K 3/38 (2006.01) H05K 3/46 (2006.01)

Patent

CA 2098411

ABSTRACT OF THE DISCLOSURE METHOD FOR PRODUCING SUBSTRATES WITH PASSAGES The method for producing aligned passages through substrate materials, in which the projection of the inlet and outlet openings does not coincide, is on the one hand characterized by a displaced application of etching windows on both sides and by a corresponding pronounced undercutting of these windows. By applying displaced etching windows on both sides of the substrate and through-etching the substrate through these windows, 'oblique' passages are obtained in the substrate. By a corresponding application of the windows it is also possible to produce branched passages with more than one outlet open- ing.

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