G - Physics – 06 – K
Patent
G - Physics
06
K
G06K 19/077 (2006.01)
Patent
CA 2541356
The invention relates to a method for production of a microcircuit card, comprising the production of a card with electronic component connector pins for an electronic component within the thickness thereof and provided with a cavity with a base and defined by a slope on which said connector pins are arranged and production of a module comprising a support film with external contacts on an external face thereof and internal contacts on an internal face thereof. An anisotropic flexible conducting adhesive is then applied to the periphery of the internal face of said film, a resin more rigid than the adhesive is introduced into the cavity of the body, the module is inserted into the cavity such that the anisotropic adhesive is located opposite the periphery of the slope of the cavity, the anisotropic adhesive is thermally activated under pressure and the resin polymerised.
Un procédé de fabrication d'une carte à microcircuit selon lequel on réalise un corps de carte comportant dans son épaisseur des bornes de connexion à un composant électronique et muni d'une cavité ayant un fond et bordée par un gradin sur lequel sont situés ces bornes de connexion et on réalise un module comportant un film support portant, sur une face externe, des contacts externes et, sur une face interne, des contacts internes et un microcircuit connecté audits contacts internes puis : - on applique sur la périphérie de la face interne dudit film un adhésif flexible conducteur anisotrope; - on dépose dans la cavité du corps de carte une résine de plus grande rigidité que l'adhésif ; - on insère dans la cavité le module en sorte que l'adhésif anisotrope se situe en regard de la périphérie du gradin de la cavité ; - on active thermiquement l'adhésif anisotrope sous pression, et on polymérise la résine.
Launay Francois
Venambre Jacques
Oberthur Card Systems Sa
Oberthur Technologies
Robic
LandOfFree
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