Method for production of microcapsule type conductive filler

Details Method for production of microcapsule type conductive filler Method for production of microcapsule type conductive filler

C - Chemistry, Metallurgy

09

J

C09J 9/02 (2006.01) B01J 13/14 (2006.01) H01B 1/00 (2006.01) H01L 23/48 (2006.01)

Patent

CA 2189801

A method for the production of the microcapsule (MC) type conductive filler of this invention comprises (a) a step involving immersing minute conductive particles in an affinity agent thereby treating the surface of the minute conductive particles, (b) a step involving immersing and dispersing the surface-treated minute conductive particles in an epoxy monomer thereby forming a suspension, and (c) a step involving polymerizing the monomer in the suspension thereby forming a thermosetting insulating polymer on the surface of the minute conductive particles. There is also disclosed an MC type conductive adhesive agent having dispersed in an adhesive agent an MC type conductive filler coated with a thermosetting resin, the thermosetting resin coating having a thickness of not more than 3 µm and having no pinholes.

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