Method for providing an inlay on a substrate

Details Method for providing an inlay on a substrate Method for providing an inlay on a substrate

B - Operations, Transporting

44

C

B44C 1/20 (2006.01) B29C 39/10 (2006.01) B44C 1/26 (2006.01)

Patent

CA 2043471

8 ABSTRACT A method for providing an inlay on a substrate includes providing a recess in the substrate, preheating the substrate to a temperature of approximately 150°F, mixing an epoxy resin with an epoxy hardener, and placing the mixture into the recess so that the mixture hardens in the recess and the heat stored in the substrate reduces the viscosity of the mixture, to aid in the removal of bubbles.

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