H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 3/46 (2006.01) H01L 23/538 (2006.01) H05K 3/40 (2006.01) H05K 3/42 (2006.01)
Patent
CA 2162499
A multi-layer circuit board includes electrical interconnections between adjacent circuit board layers of the multi-layer board. A via hole is provided through a circuit board layer. The via hole is filled with a via metal. The via metal is plated with a low melting point metal. An adhesive film is deposited over the circuit board layer. Adjacent layers of the multi-layer circuit board are stacked and aligned together. The layers are laminated under heat and pressure. The low melting point metal provides an electrical interconnection between adjacent layers.
Plaquette de circuits imprimés multicouche comprenant des interconnexions électriques entre des couches adjacentes de la plaquette multicouche. Une interconnexion entre couches est prévue dans une couche de la plaquette de circuits imprimés. Le métal de l'interconnexion est plaqué avec un métal à faible point de fusion. Un film adhésif est déposé sur la couche de la plaquette de circuits imprimés. Des autres adjacentes de la plaquette de circuits imprimés multicouche sont empilées et alignées ensemble. Les couches sont laminées dans des conditions de chaleur et de pression. Le métal à faible point de fusion assure une interconnexion électrique entre les couches adjacentes.
Gerber Joel A.
Gits Peter A.
Minnesota Mining And Manufacturing Company
Smart & Biggar
LandOfFree
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