Method for quantifying hole flow rates in film cooled parts

Details Method for quantifying hole flow rates in film cooled parts Method for quantifying hole flow rates in film cooled parts

G - Physics

01

F

G01F 1/68 (2006.01)

Patent

CA 2697111

A method for measuring a flow rate through a cooling hole (16) of a film cooled part (10) includes the steps of 1) measuring a transient thermal response of an internal surface temperature corresponding solely to an inside portion (22) of a cooling hole (16) for a film cooled part (10) resulting from a flow of fluid through the part (10), the fluid having an initial temperature that is different from an initial temperature of the film cooled part (10), 2) mathematically characterizing the transient thermal response, and 3) determining the cooling hole flow rate from the mathematical characterization.

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