Method for reducing copper solubility at the inner surface...

Details Method for reducing copper solubility at the inner surface... Method for reducing copper solubility at the inner surface...

C - Chemistry, Metallurgy

23

C

C23C 2/08 (2006.01) C23C 18/31 (2006.01) C23F 15/00 (2006.01) C23G 1/00 (2006.01)

Patent

CA 2419630

In a method for reducing copper solubility at the inner surface of a copper tube, the process parameters surface treatment (degreasing and pickling), flow conditions (flow speed < 1 m/s), temperature (50°C to 80°C) and time (1 min to min) are purposefully adjusted to one another, so as to achieve a uniformly directed crystal growth during the course of the tin coating. In particular, the planes (101) of the copper crystals and the tin crystals are aligned parallel to one another and the directions [101] are aligned perpendicular to one another.

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