Method for reducing formaldehyde content and formaldehyde...

B - Operations – Transporting – 27 – N

Patent

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B27N 7/00 (2006.01) B27N 1/00 (2006.01)

Patent

CA 2412070

A method for reducing formaldehyde content and emission from particle board in a particle board manufacturing process in which amino-adhesive resins are applied, together with added substances selected from hardening agents, formaldehyde-bonding substances, and combinations thereof, the method comprises the steps of pressing the particle board in at least one continuous--run press; selecting a seasoning temperature between 40° and 150° C based on the formaldehyde content, its expected reduction rate, and its emission rate at selected manufacturing process parameters; selecting a seasoning time between 8 and 16 hours based on the formaldehyde content, its expected reduction rate, and its emission rate at selected manufacturing process parameters; seasoning the particle board at the selected temperature for the selected time period; and cooling the board.

L'invention concerne un procédé de réduction d'un contenu et d'une émission formaldéhyde à partir d'un panneau de particules, lors de la mise en oeuvre classique d'un procédé de production d'un panneau de particules, selon des étapes connues. Ce procédé consiste à appliquer des résines amino adhésives connues, à ajouter des agents de durcissement et/ou facultativement des substances se liant au formaldéhyde, à presser le produit obtenu dans des presses à course ou à débit continu et à le refroidir. Ce procédé se caractérise en ce que ledit panneau de particules est soumis, après le pressage et avant le refroidissement, à un bref conditionnement, à une température comprise entre 70 et 110 DEG C, pendant plusieurs heures, jusqu'à une douzaine, de préférence pendant une période comprise entre 8 et 16 heures, en fonction du taux de réduction désiré du contenu et de l'émission formaldéhyde et des paramètres du processus de fabrication appliqués.

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