Method for reversibly mounting a device wafer to a carrier...

Details Method for reversibly mounting a device wafer to a carrier... Method for reversibly mounting a device wafer to a carrier...

H - Electricity

01

L

H01L 23/12 (2006.01) H01L 23/48 (2006.01)

Patent

CA 2711266

New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subse-quent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

L'invention porte sur de nouveaux procédés de liaison temporaire et sur des articles formés à partir de ces procédés. Les procédés comprennent la liaison d'une tranche de dispositif à une tranche de support ou substrat uniquement au niveau de leurs périmètres externes afin d'aider à protéger la tranche de dispositif et ses sites de dispositif durant un traitement et une manipulation ultérieurs. Les liaisons de bord formées par ce procédé sont résistantes chimiquement et thermiquement, mais peuvent également être assouplies, dissoutes, ou mécaniquement interrompues pour permettre aux tranches d'être facilement séparées avec de très faibles forces et à ou proches de la température ambiante à l'étape appropriée dans le procédé de fabrication.

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