Method for selective removal of copper contaminants from...

Details Method for selective removal of copper contaminants from... Method for selective removal of copper contaminants from...

C - Chemistry, Metallurgy

02

F

204/89

C02F 1/46 (2006.01) C23C 18/16 (2006.01) C25C 1/12 (2006.01) H05K 3/00 (2006.01)

Patent

CA 1166601

ABSTRACT OF THE DISCLOSURE A method is provided for selective removal of copper contaminants from aqueous activator solutions which also contain palladium and tin. It comprises placement of insoluble electrodes in the aqueous solution and application of a low voltage, preferably ranging from between 0.05 to 5.0 volts across the electrodes, whereby metallic copper is selectively deposited upon the cathode, with palladium and tin remaining in the aqueous solutions. Typically, the solutions copper ions are present as contaminants in activator solutions utilized in various electroless metal plating processes.

376942

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