C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
C25D 5/54 (2006.01) B05D 1/18 (2006.01) B05D 3/00 (2006.01) B05D 5/12 (2006.01) C25D 5/02 (2006.01) H01B 1/22 (2006.01) H01B 1/24 (2006.01) H05K 3/42 (2006.01) B05D 7/14 (2006.01)
Patent
CA 2102240
ABSTRACT OF THE DISCLOSURE A method for coating non-conductors with carbon particles, comprising the following stages: a) treatment with a copper-containing solution; b) coating a non- conductor with an aqueous solution of gelatine or polyacrylate; c) rinsing with water; d) contacting with a dispersion containing carbon, a wetting agent and an ionogenic metal compound; e) rinsing with water. This method selectively produces electrically conducting surfaces, and is suitable for the direct metallization of non-conductors. After being coated with carbon, the non- conductor can be electroplated directly. The use of copper- containing solutions in the method is also described.
Besenhard Jurgen-Otto
Gausmann Hans P.
Mahlkow Harmut
Meyer Heinrich
Atotech Deutschland Gmbh
Riches Mckenzie & Herbert Llp
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